PETALING JAYA: Northern Corridor Implementation Authority (NCIA) and the National Manufacturing Institute Scotland (NMIS) have signed a memorandum of collaboration (MoC) to strengthen cooperation in advancing high-value manufacturing and services, semiconductor innovation, talent and ecosystem development in moving up the value chain within the Northern Corridor Economic Region (NCER) of Peninsular Malaysia.
The five-year collaboration, spanning 2026 to 2031, will leverage the NCER Technology Innovation Centre (NTIC) programmes and the latest initiative, the Advanced Packaging Institute and Research Centre (APIRC), serve as key platforms to accelerate research, development, commercialisation and innovation activities, while supporting the growth of LLCs (large local companies) and SMEs.
The collaboration will focus on strategic sectors such as electrical and electronics, semiconductors, aerospace, automotive, logistics and digital economy, along with emerging technologies, including advanced packaging, power electronics and silicon photonics.
NMIS will also support the facilitation and promotion of collaboration activities in the industry clusters and in the ecosystem development in the NCER thematic industrial parks, such as Chuping Valley Industrial Area, Kedah Rubber City and Kedah Science and Technology Park, through NTIC programmes and initiatives.
Under the MoC, NMIS will provide strategic advisory, facilitate industry-research collaborations, and drive deep technology adoption among LLCs and SMEs.
NTIC will coordinate activities via APIRC to strengthen the value chain ecosystem in NCER.
The collaboration will also support APIRC’s goal of achieving RM8.5 billion in new investments and the development of 12 local companies within the advanced packaging ecosystem by 2030.
NCIA chief executive Datuk Mohamad Haris Kader Sultan said the collaboration marks a key milestone in positioning the Northern Corridor as a leading hub for advanced manufacturing and semiconductor innovation.
“Through NTIC and APIRC, we are building a comprehensive ecosystem to accelerate innovation, strengthen local capabilities, and enable our LLCs and SMEs to move up the global value chain.
“NMIS brings world-class expertise in advanced manufacturing and technology commercialisation. By combining our strengths, we will create greater opportunities for talent development, industry collaboration and investment attraction, further reinforcing NCER’s competitiveness in high-value industries.
“We aim to shorten the innovation cycle for local companies by providing access to global expertise, advanced technologies and strategic industry networks.
“This will enable our LLCs, SMEs and industry players to achieve competitive development costs, accelerate commercialisation and compete more effectively in the rapidly evolving global semiconductor and advanced manufacturing landscape,” he said.
British Deputy High Commissioner to Malaysia David Wallace said NMIS is pleased to partner with NCIA in developing a dynamic manufacturing and semiconductor ecosystem in Malaysia’s Northern Corridor.
“We are impressed by NTIC and APIRC’s capabilities and see strong potential in advanced packaging, power electronics, and compound semiconductors.
“This partnership reflects our shared commitment to accelerating innovation,
developing future-ready talent and helping businesses adopt advanced technologies that will enhance productivity, competitiveness and sustainable growth,“ he said.
The collaboration is expected to strengthen international knowledge exchange, foster technology transfer and create new opportunities for industry participation, supporting Malaysia’s aspirations to move further up the semiconductor value chain while enhancing the NCER’s position as a regional centre for advanced manufacturing and innovation.
The programmes offered under NTIC include the Advanced Technology Meister Programme, Technology and Innovation, Centre of Excellence (CoE), Industry-Driven Technology Module and Industry Competency Fast-Track Programme.
Meanwhile, APIRC, a strategic collaboration between NCIA and Silicon Connect Sdn Bhd (NTIC’s CoE provider), delivers advanced packaging solutions covering design, prototyping, and chip sample production.
